Wikipedia

LGA 1700

LGA 1700 (Socket V) is a zero insertion force flip-chip land grid array (LGA) socket, compatible with Intel desktop processors Alder Lake and Raptor Lake, which was first released in November 2021.

LGA 1700
Release dateNovember 4, 2021 (2021-11-04)
Designed byIntel
Manufactured byLotes
TypeLGA-ZIF
Chip form factorsFlip-chip
Contacts1700
FSB protocolPCI Express 5.0
Direct Media Interface
Processor dimensions37.5 mm × 45 mm
1,687.5mm2
Processors
PredecessorLGA 1200
SuccessorLGA 1851
Memory support
This article is part of the CPU socket series

LGA 1700 is designed as a replacement for LGA 1200 (known as Socket H5) and it has 1700 protruding pins to make contact with the pads on the processor. Compared to its predecessor, it has 500 more pins, which required a major change in socket and processor sizes; it is 7.5 mm longer. It is the first major change in Intel's LGA desktop CPU socket size since the introduction of LGA 775 in 2004, especially for consumer-grade CPU sockets. The larger size also required a change in the heatsink fastening holes configuration, making previously used cooling solutions incompatible with LGA 1700 motherboards and CPUs.[2]

Heatsink design

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Since the introduction of land grid array (LGA)-based sockets in the consumer hardware space in 2004,[3] the thermal solution hole pattern (the distance between centers of the screw-holes for the heatsink) has changed three times for Intel's mainstream platforms:

While some motherboards do offer additional mounting holes for using older coolers, e.g. for using an LGA115x cooler on an LGA1700 motherboard, differences in Z-height and the mounting pressure will result in worse than expected cooling performance. For best results it is recommended to either change the cooling solution to a model certified for this platform or request an updated mounting-kit[4][5][6] for one of the higher-end solutions on the market. For heatsinks to be interchangeable, not only the hole pattern, but also the socket seating plane height, the maximum thermal solution center of gravity height from the IHS and the static total compressive minimum need to match.

Issues

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Even though some CPU cooler manufacturers are providing adapter kits (usually in the form of different screws) to go with existing LGA115x and LGA1200 retention brackets, there have been reports of the CPU bending or bowing due to uneven mounting pressure from the LGA 1700 integrated loading mechanism (ILM). This leads to the CPU having reduced contact with the cooler plate, which in turn leads to increased temperatures.[7] LGA 1700 contact frames to replace the stock ILM have been released by Thermal Grizzly and Thermalright to ensure even CPU mounting pressure and cooler contact.[8][9]

Maximum RAM

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Initially motherboards based on Alder Lake and Raptor Lake chipsets supported 32 GB memory modules but most known OEMs in 2023 updated BIOS'es to support 48 GB modules and in December 2023 support for 64 GB modules started to roll out first by MSI and ASRock.[10][11] Users are advised to consult with their motherboards web support pages to check what memory modules can be installed.

Alder Lake chipsets (600 series)

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H610[12] B660[13] H670[14] Q670[15] Z690[16] W680[17]
Overclocking No RAM; BCLK on some ASRock, ASUS and MSI motherboards[18][19][20][21] RAM only No Yes
Bus interface DMI 4.0 ×4 DMI 4.0 ×8
CPU support Alder Lake
Raptor Lake (a BIOS update may be required)
Memory capacity Up to 64/128 GB[a] Up to 128/256 GB[a] Up to 128/256 GB with ECC[a]
Maximum DIMM slots 2 4
Maximum USB 2.0 ports 10 12 14
USB 3.2 ports configuration Gen 1x1 Up to 4 Up to 6 Up to 8 Up to 10
Gen 2 ×1 Up to 2 Up to 4 Up to 8 Up to 10
×2 None Up to 2 Up to 4
Maximum SATA 3.0 ports 4 8
Processor PCI Express configuration 5.0 1×16 1×16 or 2×8
4.0 None 1×4
PCH PCI Express configuration 4.0 None 6 12
3.0 8 12 16
Independent display support (digital ports/pipes) 3 4
Integrated wireless suggested: Intel Wi-Fi 6E AX211 (802.11ax / Wi-Fi 6E / Bluetooth 5.3)[b]
PCIe RAID support No 0, 1, 5
SATA RAID support No 0, 1, 5, 10[22]
Intel Optane memory support No Yes
Intel Smart Sound[23] technology Yes
Intel Active Management, Trusted Execution and vPro technology No Yes No Yes
Chipset TDP 6 W
Release date Q1 2022 Q4 2021 Q2 2022
  1. ^ a b c RAM capacity might be limited to the first number before a BIOS update
  2. ^ Depends on OEM's implementation. OEMs include Wi-Fi chips as optional M.2 CNVio2 boards and can also choose from previous generations, such as the AX201 (Wi-Fi 6 / BT 5.2).

Raptor Lake chipsets (700 series)

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B760[24] H770[25] Z790[26]
Overclocking RAM; BCLK on some ASRock and MSI motherboards, 12th Gen CPUs only. 13th Gen disabled BCLK OC at CPU microcode level[27][28][29] RAM only Yes
Bus Interface DMI 4.0 ×4 DMI 4.0 ×8
CPU support Alder Lake and Raptor Lake
Memory capacity Up to 128/256 GB[a]
Maximum DIMM slots 4
Maximum USB 2.0 ports 12 14
USB 3.2 ports configuration Gen 1x1 Up to 6 Up to 8 Up to 10
Gen 2 ×1 Up to 4 Up to 10
×2 Up to 2 Up to 5
Maximum SATA 3.0 ports 4 8
Processor PCI Express configuration 5.0 1x16 1×16 or 2×8
4.0 (for M.2) 1x4
PCH PCI Express configuration 4.0 10 16 20
3.0 4 8
Independent display support (digital ports/pipes) 4
Integrated wireless Intel Wi-Fi 6E AX211 (802.11ax / Wi-Fi 6E / Bluetooth 5.3)[b]
PCIe RAID support No 0, 1, 5
SATA RAID support 0, 1, 5, 10
Intel Optane memory support Yes
Intel Smart Sound technology Yes
Intel Active Management, Trusted Execution and vPro technology No
Chipset TDP 6 W
Release date Q1 2023 Q4 2022
  1. ^ RAM capacity might be limited to the first number before a BIOS update
  2. ^ depends on OEM's implementation

See also

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References

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  1. ^ "Architecture Day 2021" (PDF). Intel. Retrieved October 19, 2022.
  2. ^ Shilov, Anton (April 9, 2021). "Keep Your Cool(er): Noctua Confirms Intel Alder Lake CPU Support". Tom's Hardware. Retrieved September 20, 2021.
  3. ^ Shimpi, Anand Lal (June 21, 2004). "Intel's 925X & LGA-775: Are Prescott 3.6 and PCI Express Graphics any Faster?". AnandTech. Retrieved November 12, 2022.
  4. ^ "Noctua Announces Free-of-charge Mounting Upgrades and Updated CPU Coolers for LGA1700". TechPowerUp. August 17, 2021. Retrieved October 19, 2022.
  5. ^ "Cooler Master Announces Free Mounting Upgrades for LGA1700 Release". TechPowerUp. November 4, 2021. Retrieved October 19, 2022.
  6. ^ Skrobisch, Stephan (September 29, 2021). "be quiet! macht seine CPU-Kühler fit für den Socket LGA1700" [be quiet! makes their CPU coolers fit for Socket LGA1700]. Hardware Luxx (in German). Retrieved October 19, 2022.
  7. ^ Wallossek, Igor (December 8, 2021). "Cooling issues with Intel's Alder Lake – Problems with the LGA-1700 socket and a possible workaround". Igor's Lab. Retrieved December 11, 2021.
  8. ^ Norem, Josh (June 1, 2022). "Thermal Grizzly Launches Alder Lake 'Contract Frame' to Help Reduce Temps". ExtremeTech. Retrieved November 12, 2022.
  9. ^ "Thermalright launches Bending Corrector Frame for Alder Lake processors". VideoCardz. April 21, 2022. Retrieved November 12, 2022.
  10. ^ btarunr (December 18, 2023). "ASRock Adds 256GB Max Memory and 64GB DIMM Support to its AMD AM5 and Intel 700-series Motherboards". TechPowerUp.
  11. ^ btarunr (December 15, 2023). "MSI Motherboards Unleash Extreme Power with Memory Capacity Boosted To 256GB". TechPowerUp.
  12. ^ "Product Specifications". www.intel.com.
  13. ^ "Product Specifications". www.intel.com.
  14. ^ "Product Specifications". www.intel.com.
  15. ^ Intel® Q670 Chipset
  16. ^ "Product Specifications". www.intel.com.
  17. ^ Intel® W680 Chipset
  18. ^ "Der8auer overclocks Core i5-12400 non-K CPU to 5GHz on ASUS B660 DDR5 motherboard". VideoCardz. January 20, 2022. Retrieved October 19, 2022.
  19. ^ Wilson, Jason R. (January 21, 2022). "Intel warns users to NOT overclock their non-K Alder Lake CPUs, cites 'Damaging'". Wccftech. Retrieved October 19, 2022.
  20. ^ "Intel 12th gen non-K OC capable boards / Bios versions". HWBOT Community Forums. January 16, 2022. Retrieved October 19, 2022.
  21. ^ Olšan, Jan (February 12, 2022). "Overclocking 65W Alder Lake processors: Which boards can do it?". HW Cooling. Retrieved October 19, 2022.
  22. ^ Liu, Zhiye (January 4, 2022). "Intel H670, B660 and H610 Chipset Analysis and Motherboard Roundup". Tom's Hardware. Retrieved November 12, 2022.
  23. ^ Smart sound technology
  24. ^ "Product Specifications". www.intel.com.
  25. ^ "Product Specifications". www.intel.com.
  26. ^ "Product Specifications". www.intel.com.
  27. ^ "MSI B760 Motherboard Overclocks Locked Intel CPUs". Tomshardware. December 28, 2022. Retrieved June 25, 2023.
  28. ^ "ASRock B760M PG Riptide Review: A Good Budget Balance". Tomshardware. May 26, 2023. Retrieved June 25, 2023.
  29. ^ "Intel 13th Gen Non-K CPUs Have "BCLK" Overclocking Completely Locked Out". wccftech. January 20, 2023. Retrieved June 25, 2023.
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