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File:POWER2+-MCM.jpg

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Original file (1,488 × 1,488 pixels, file size: 420 KB, MIME type: image/jpeg)

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English: An illustration of an IBM POWER2+ microprocessor multi chip module. The chips are manufactured on a 0.7 μm CMOS process mounted on a ceramic pin grid array substrate. Inspiration for the image comes from pictures on the Internet, IBM and privately owned photos.
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Author Henriok

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I, the copyright holder of this work, hereby publish it under the following license:
Creative Commons CC-Zero This file is made available under the Creative Commons CC0 1.0 Universal Public Domain Dedication.
The person who associated a work with this deed has dedicated the work to the public domain by waiving all of their rights to the work worldwide under copyright law, including all related and neighboring rights, to the extent allowed by law. You can copy, modify, distribute and perform the work, even for commercial purposes, all without asking permission.

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9 July 2014

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Date/TimeThumbnailDimensionsUserComment
current17:38, 9 July 2014Thumbnail for version as of 17:38, 9 July 20141,488 × 1,488 (420 KB)HenriokUser created page with UploadWizard

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